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polyimide film造句

"polyimide film"是什麼意思  polyimide filmの例文  
造句與例句手機版
  • Mica tapes - polyimide film - backed mica paper tapes
    云母帶.聚酰亞胺薄膜粉云母帶
  • Adhesive coated polyimide film for flexible printed circuits
    撓性印制電路用涂膠聚酰亞胺薄膜
  • Evaluation of polyimide film developing level in china
    我國聚酰亞胺薄膜制造技術發展水平的評估
  • Copper - clad laminates for flexible printed wiring boards polyester film , polyimide film
    柔性印制電路板用包銅層壓板
  • The effect on thermal stability of polyimide films based on phthalimide end - capped odpa and oda
    聚酰亞胺薄膜熱穩定性的影響
  • Studies of the structural conversion and property change of polyimide film during the carbonization
    膜碳化過程中結構和性能變化研究
  • The dopping effect of nano - inorganic on structure and dielectric properties of polyimide films
    無機納米摻雜對聚酰亞胺薄膜的結構和介電性能影響
  • Measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
    兩種聚酰亞胺薄膜光頻相對介電常數的測定
  • Base material for printed circuits - specifications - flexible copper - clad polyimide film , general purpose grade
    印制電路板基材.第2部分:規范.第13節:通用柔性覆銅聚酰亞胺膜
  • Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling
    摘要測量了聚酰亞胺薄膜在冷熱循環過程中各溫度點的熱膨脹系數。
  • It's difficult to see polyimide film in a sentence. 用polyimide film造句挺難的
  • Base materials or printed circuits . part 2 : specifications . speciication no 13 : flexible copper - clad polyimide film , general purpose grade
    印刷電路用基材.第2部分:規范. 13號規范:一般用途級包銅軟聚酰亞胺薄膜
  • Base materials for printed circuits ; part 2 : specifications ; specification no . 13 : flexible copper - clad polyimide film , general purpose grade
    印制電路用基材.第2部分:規范.第13號規范:通用級軟覆銅聚酰亞胺薄膜,通用級
  • Base materials for printed circuits . part 2 : specifications . specification no . 15 : flexible copper - clad polyimide films of defined flammability
    印制電路用基材.第2部分:規范.第15號規范:規定的易燃性的軟覆銅聚酰亞胺薄膜
  • Specification for plastic films for electrical purposes - specifications for individual materials - requirements for polyimide films used for electrical insulation
    電工用塑料薄膜規范.各型材料規范.電絕緣用聚酰亞胺薄膜要求
  • Specifications for pressure - sensitive adhesive tapes for electrical purposes - specifications for individual materials - polyimide film tapes with pressure - sensitive adhesive
    電氣用壓敏膠帶規范.單個材料規范.帶壓敏膠粘劑的聚酰亞胺膜帶
  • The results showe that the thermal expand coefficient of polyimide film is instability , it tends to stabilization after four times of psychro - thermal cycles
    結果表明:聚酰亞胺薄膜的熱膨脹系數具有不穩定性,當經四次冷熱循環后才趨于穩定。
  • Pressure - sensitive adhesive tapes for electrical purposes - part 3 : specifications for individual materials - sheet 7 : polyimide film tapes with pressure - sensitive adhesive
    電工用壓敏粘帶規范.第3部分:單項材料規范.第7活頁:聚酰亞胺薄膜粘帶
  • Pressure - sensitive adhesive tapes for electrical purposes . part 3 : specifications for individual materials . sheet 7 : polyimide film tapes with pressure - sensitive adhesive
    電工用壓敏膠帶.第3部分:專用材料規范.活頁7 :涂覆壓敏膠的聚酰亞胺薄膜膠帶
  • Specification for plastic films for electrical purposes . part 3 : specifications for individual materials . sheets 4 to 6 : requirements for polyimide films used for electrical insulation
    電氣用塑料薄膜規范.第3部分:專用材料規范.活頁4 - 6 :電絕緣用聚酰亞胺薄膜要求
  • Specification for plastic films for electrical purposes ; part 3 : specifications for individual materials ; sheets 4 to 6 : requirements for polyimide films used for electrical insulation
    電工用塑料薄膜規范.第3部分:各別材料規范.第4 - 6活頁:電絕緣用聚酰亞胺薄膜要求
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